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Texas Instruments CDC3RL02BYFPR — Clock & Timing ICs

TI CDC3RL02BYFPR Fanout Buffer, 1:2 LVCMOS, 52 MHz, 8-DSBGA

MPNCDC3RL02BYFPR
End of Life

Texas Instruments CDC3RL02BYFPR, Fanout Buffer (Distribution), 1:2 LVCMOS input/output, 52 MHz max, 2.3V-5.5V supply, -40°C to 85°C, 8-DSBGA package.

$1.71Ref. price · indicative, final on quote
Packaging8-XFBGA, DSBGA
RoHSROHS3 Compliant
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

CDC3RL02BYFPR specifications
ParameterValue
TypeFanout Buffer (Distribution)
MountingSurface Mount
Voltage2.3V ~ 5.5V
Frequency52 MHz
Operating temperature-40°C ~ 85°C
InputLVCMOS
OutputLVCMOS
PackageTape & Reel (TR); Cut Tape (CT)
Case8-XFBGA, DSBGA
Number of circuits1
Ratio - Input:Output1:2
Differential - Input:OutputNo/No

Product details

The Texas Instruments CDC3RL02BYFPR is a 1:2 fanout buffer that takes a single LVCMOS clock input and delivers two LVCMOS outputs, rated for frequencies up to 52 MHz. It is not a PLL or jitter cleaner — it is a simple, low-skew distribution buffer for splitting a clock signal to two loads on the same board. The supply range from 2.3 V to 5.5 V means it can sit on a 3.3 V or 5 V rail without an extra regulator, and the industrial temperature grade (-40°C to 85°C) qualifies it for outdoor telecom cabinets, factory-floor controllers, and motor-drive control logic where the ambient sees thermal cycling.

The 52 MHz ceiling places this buffer in the low-to-mid-speed clock distribution tier. It handles the common 25 MHz, 40 MHz, and 50 MHz reference clocks used by MCUs, Ethernet PHYs, and FPGAs in the sub-100 MHz range. If your design distributes a 100 MHz+ oscillator or a high-speed serial reference, this part will not pass it — that is where a differential buffer like the CDCLVP1204 (2 GHz capable) would be needed. For a 50 MHz crystal oscillator feeding two downstream devices, the CDC3RL02BYFPR is a clean, low-cost fit.

Package and layout: 8-DSBGA

The 8-DSBGA package (0.4 mm pitch, roughly 1.6 mm × 1.6 mm body) is a tiny wafer-level chip-scale package. A solder-mask-defined pad with micro-vias under the BGA is the standard approach. No thermal pad to worry about; the package dissipation is low for a fanout buffer running at 52 MHz.

Frequently asked questions

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Is CDC3RL02BYFPR obsolete or still active?

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What is the datasheet and pin configuration for CDC3RL02BYFPR?

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Can CDC3RL02BYFPR be used as a drop-in replacement for other 1:2 clock buffers?

Quick replacement verification saves troubleshooting time for maintenance and repair teams.