CD4049UBDR

Texas Instruments · 4000B Series

Texas Instruments 4000B series hex inverter, CD4049UBDR, 6 circuits, 1 input per gate, 3V to 18V supply, 50ns prop delay at 15V/50pF, 4µA quiescent, -55°C to 125°C, 16-SOIC package.

Texas Instruments CD4049UBDR
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MOQ 5 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

CD4049UBDR specifications
Parameter / AttributeSpecification / Value
Series4000B
Logic typeInverter
MountingSurface Mount
Supply voltage3V ~ 18V
Current - quiescent4 µA
Current - output high, low4.3mA, 24mA
I/O channels1
Operating temperature-55°C ~ 125°C
PackageTape & Reel (TR); Cut Tape (CT)
Case16-SOIC (0.154\", 3.90mm Width)
Number of circuits6
Input logic level - low1V ~ 2.5V
Input logic level - high4V ~ 12.5V
Max propagation delay @ v, max CL50ns @ 15V, 50pF

Technical details

What the 3V to 18V supply range buys the design

Each gate draws a maximum 4µA quiescent current, so the part can sit on an always-on power domain without draining the backup battery.

Output drive and fan-out — the asymmetry to budget for

The output stage delivers 4.3mA sourcing and 24mA sinking. That 5.6:1 ratio means the CD4049UBDR can drive a heavier pull-down load than pull-up — useful when interfacing to open-drain buses or driving the base of an NPN transistor, but a constraint if you need symmetric drive into a terminated transmission line. The 50ns propagation delay at 15V and 50pF is the timing ceiling; at lower supply voltages the delay stretches, so a timing closure check is needed if the part runs at 5V in a 1MHz control loop.

Package and footprint — what the SOIC-16 tells the layout

The CD4049UBDR is supplied in a 16-SOIC body, 3.90mm width, surface-mount only. The 1.27mm pin pitch is standard for automated assembly and rework.

The date-code and marking should trace cleanly to TI's authorized chain — any lot with inconsistent laser etch or mismatched font on the package body warrants a decap check before accepting it on a production line.

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