2.71 x 2.71 mm DSBGA — BLE MCU with 14 GPIO
The Texas Instruments CC2640R2FYFVT is a SimpleLink™ wireless MCU combining a Bluetooth v5.1-compliant radio with an ARM Cortex-M3 core in a 34-DSBGA package measuring 2.71x2.71 mm. It integrates 128 kB of Flash and 28 kB of SRAM, providing enough code space for BLE stack plus application firmware, with the 28 kB SRAM handling data buffering for sensor payloads or OTA transfers. The radio delivers a sensitivity of -97 dBm and a maximum output power of 5 dBm, supporting a link budget that suits indoor beacon, wearable, and IoT sensor nodes operating in the 2.4 GHz ISM band.
14 GPIO and serial interfaces for peripheral integration
With 14 GPIO pins and serial interfaces including I²C, I²S, SPI, and UART, this device can connect to sensors, displays, audio codecs, and external memory without a separate host MCU.
For a pin-compatible alternative within the same family, the CC2640R2FRGZT shares the same Bluetooth v5.1 radio and memory footprint but differs in the 34-VQFN package versus this DSBGA variant — a consideration if board-level rework or X-ray inspection is part of your assembly process.
DSBGA assembly and handling note
The 34-DSBGA package (2.71x2.71 mm) uses a 0.4 mm pitch ball grid array. This footprint requires a well-controlled reflow profile and X-ray inspection after soldering to verify joint integrity. Moisture sensitivity level (MSL) should be verified from the manufacturer's label — typical for this package class is MSL 3, meaning bake before reflow if the sealed bag has been open longer than the floor-life window.