Texas Instruments CC2640F128RHBR — RF & Wireless ICs
Technical Documents PDF / CAD
RoHS Compliant · Lead-Free EIA-481 Standard
Texas Instruments / RF & Wireless ICs

CC2640F128RHBR SimpleLink Bluetooth 4.1 MCU, 128 kB Flash

MPN CC2640F128RHBR
Active Spot Stock · 24-48h Dispatch 100% Original Sealed

Texas Instruments SimpleLink CC2640F128RHBR, TxRx + MCU, Bluetooth v4.1, 2.4 GHz, 128 kB Flash, 28 kB SRAM, 15 GPIO, -97 dBm sensitivity, 5 dBm output, 1.8 V–3.8 V, -40°C to 85°C, 32-VQFN (5x5).

In Stock: 1 pcs
MOQ: 1 pcs
Logistics: DHL / FedEx DAP (Global Express · 3-7d) Russia & CIS DDP (Door-to-Door Cleared)
Dispatch: Shenzhen / HK
Unit Price (USD)
$14.53 / pc
Direct Purchase Ready
Volume Pricing Breaks Confirmed upon quotation
1+ pcs
$14.53
Working on a production BOM or have a target unit price? Submit Target Price
Buy Now

$14.53 / ea

1 in stock — maximum per order · 3–4 days lead time

Upload Full BOM List
[SPEC] Essential Parameters Snapshot Full Specifications (19)
Supply Voltage 1.8V ~ 3.8V
Memory / RAM 128kB Flash, 28kB SRAM

Full Technical Specifications

19 Parameters

Primary Technical Parameters

CC2640F128RHBR key specifications
Parameter / AttributeSpecification / Value
TypeTxRx + MCU
SeriesSimpleLink™
MountingSurface Mount
RF familyBluetooth
Supply voltage1.8V ~ 3.8V
Current - receiving5.9mA ~ 6.1mA
Current - transmitting6.1mA ~ 9.1mA
Power - output5dBm
Frequency2.4GHz
ProtocolBluetooth v4.1
Serial interfacesI2C, I2S, JTAG, SPI, UART
Operating temperature-40°C ~ 85°C

Additional Specifications

CC2640F128RHBR additional specifications
Parameter / AttributeSpecification / Value
GPIO15
PackageTape & Reel (TR) Cut Tape (CT)
ModulationDSSS, O-QPSK, GFSK
Memory size128kB Flash, 28kB SRAM
Sensitivity-97dBm
Case32-VFQFN Exposed Pad
Data rate1Mbps
[DESK] Shenzhen Spot Allocation · 2h Response

Need Immediate Spot Stock or Shortage Allocation for CC2640F128RHBR?

Factory lead times blocking production? We lock verified brand-new original stock in Shenzhen within 2 hours.

Quote SLA 2 Hours
[01] Emergency Shortage 24-48h Shenzhen Dispatch

Direct access to Shenzhen floor inventory, franchised allocation buffers, and factory bonded stock to resolve line-down shutdowns.

[02] Industrial Packaging Tape & Reel / Tray / Tube

Standard factory-sealed packaging compliant with EIA-481 standards for automated high-speed SMT pick-and-place lines.

[03] WhatsApp QC Proof 45x Microscope QC Photos

High-resolution photos of original reel labels, 2D DataMatrix, and pin coplanarity sent via WhatsApp/Telegram before you release wire payment.

● USD Wire Transfer (SWIFT T/T) · DAP Express / DDP Delivery

Technical Details & Description

128 kB Flash and 28 kB SRAM — firmware headroom for BLE stacks

The 128 kB Flash and 28 kB SRAM accommodate the Bluetooth v4.1 protocol stack plus a moderate application payload. For a sensor node running the BLE stack and a small application loop, this memory budget is typical. If the design requires over-the-air firmware updates or a larger application image, the 128 kB Flash may be tight — plan the memory map early.

Bluetooth v4.1 — not Bluetooth 5 compatible

This part implements Bluetooth v4.1, which means it does not support Bluetooth 5 features such as 2 Mbps PHY, extended advertising, or LE Audio. For BLE 4.1 applications (beacons, remote sensors, HID devices), this part is well matched.

-97 dBm sensitivity and 5 dBm TX power — link budget for range

Receiver sensitivity of -97 dBm and a maximum transmit power of 5 dBm give a link budget around 102 dB in free space, which translates to roughly 100–200 meters line-of-sight depending on antenna and environment. For indoor applications through walls, expect 20–40 meters. The 1 Mbps data rate is the standard BLE 4.1 rate.

15 GPIOs and serial interfaces

Fifteen GPIOs are available on the 32-VQFN package. The serial interface set includes I2C, I2S, JTAG, SPI, and UART, which covers most sensor and actuator peripherals. The JTAG interface is the primary debug and programming port; TI's CC13xx/CC26xx SDK and a compatible debug probe (e.g., XDS110 or LAUNCHXL-CC2640R2) are used for development.

Frequently asked questions

Can CC2640F128RHBR be used as a drop-in replacement for CC2640R2F?

No. The CC2640F128RHBR supports Bluetooth v4.1, while the CC2640R2F supports Bluetooth 5. The two parts are not pin-compatible for a drop-in replacement; the firmware stack and memory layout differ. Verify the design's BLE version requirement before substituting.

What is the maximum number of concurrent connections for CC2640F128RHBR?

The evidence does not specify a maximum concurrent connection count. For BLE 4.1, typical implementations support up to eight connections in the peripheral role, but this depends on the stack configuration and available SRAM (28 kB). Consult the TI BLE-Stack user guide for the exact limit.

CC2640F128RHBR
Verified Allocation
Quote