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Texas Instruments BQ25121YFPR — Power Management (PMIC / Gate Driver)

BQ25121YFPR - TI Linear Li-Ion Charger, 300 mA, I²C

MPNBQ25121YFPR
NRND

Texas Instruments BQ25121YFPR, single-cell Li-Ion linear charger, 300 mA max charge current, I²C interface, 25-XFBGA DSBGA package, -40°C to 125°C junction temperature.

$3.0240Ref. price · indicative, final on quote
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

BQ25121YFPR Technical Specifications
ParameterValue
Mounting typeSurface Mount
Battery pack voltage4.2V
Voltage5.5V
Current - chargingConstant - Programmable
Charge current - max300mA
InterfaceI²C
Operating temperature-40°C~125°C(TJ)
PackageTape & Reel (TR)
Case25-XFBGA, DSBGA
Number of cells1
Fault protectionOver Voltage
Battery chemistryLithium Ion
Programmable featuresCurrent

Product details

Linear charger for small Li-Ion packs

The Texas Instruments BQ25121YFPR is a single-cell linear Li-Ion charger delivering up to 300 mA charge current, with the charge current set via an I²C interface for on-the-fly adjustment.

Charge current and I²C programmability

The 300 mA maximum charge current targets small-capacity Li-Ion cells typical in wearables, hearing aids, and IoT end-nodes. The constant-current, constant-voltage profile is standard for Li-Ion, but the I²C interface allows the system MCU to adjust the charge current dynamically — useful for thermal management or charging from a current-limited source. Over-voltage fault protection is built in; no external blocking diode is needed if the input voltage stays below the 5.5 V supply max.

NRND — plan for a replacement

That means TI is not actively promoting it for new projects, though it remains available for existing production. For a new BOM, look at the current-generation BQ2512x family — the BQ25120A or BQ25125 are the natural successors with similar feature sets and pin compatibility.

Package and field handling

The 25-DSBGA package is a 0.4 mm pitch wafer-level chip-scale package. No lab, no bench — but you do need a hot-air station or reflow oven with a fine-tip stencil to place it. The solder balls are on the bottom; orientation is marked by a corner dot on the package top. ESD-sensitive, so keep it in the conductive foam or tape until reflow. The tape-and-reel delivery is standard for pick-and-place.

Frequently asked questions

Is the BQ25121YFPR obsolete?

It is not fully discontinued, but TI advises against using it in new designs. For existing production, it can still be sourced through independent channels.