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Texas Instruments BQ24166YFFR — Power Management (PMIC / Gate Driver)

TI BQ24166YFFR Li-Ion Battery Charger IC, 2.5 A

MPNBQ24166YFFR
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Texas Instruments BQ24166YFFR, single-cell Li-Ion battery charger IC, USB interface, 2.5 A max charge current, 10 V max supply, 49-DSBGA (2.8x2.8) package, -40°C to 85°C operating temperature.

$2.9700Ref. price · indicative, final on quote
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

BQ24166YFFR Technical Specifications
ParameterValue
Mounting typeSurface Mount
Battery pack voltage3.7V
Voltage10V
Current - chargingConstant - Programmable
Charge current - max2.5A
InterfaceUSB
Operating temperature-40°C~85°C(TA)
PackageTape & Reel (TR)
Case49-UFBGA, DSBGA
Number of cells1
Fault protectionOver Temperature, Short Circuit
Battery chemistryLithium Ion

Product details

Single-cell Li-Ion charger with USB input

The Texas Instruments BQ24166YFFR is a single-cell Lithium Ion battery charger IC designed for USB-powered portable devices. It integrates a programmable constant-current charge path with a maximum charge current of 2.5 A, and accepts a supply voltage up to 10 V, covering standard 5 V USB and 9 V fast-charge adapters. Built-in fault protection includes over-temperature and short-circuit detection, reducing the need for external supervisory circuitry.

49-DSBGA footprint and rework considerations

The BQ24166YFFR is supplied in a 49-UFBGA, DSBGA package (49-DSBGA, 2.8x2.8 mm body). This ultra-small footprint saves board area but demands careful PCB layout: the 0.4 mm ball pitch requires a fine-line fan-out and a controlled solder-paste stencil. Reworking a DSBGA by hand is possible with a hot-air station and a stencil alignment jig, but the part's small size makes optical alignment critical — a misaligned reflow can short adjacent balls. Moisture sensitivity level (MSL) should be verified per the reel label before rework; a pre-bake at 125°C for 8 hours is typical if the floor life has been exceeded.

The Tape & Reel (TR) packaging is standard for volume production.

Frequently asked questions

What is the difference between BQ24166 and BQ24166YFFR?

The base product number is BQ24166. The 'YFFR' suffix indicates the specific package variant — the 49-DSBGA (2.8x2.8) package and Tape & Reel packaging. Functionally, the BQ24166 die is identical across package variants; the difference is purely in the physical footprint and shipping format.

Is BQ24166YFFR lead-free?

The BQ24166YFFR is a DSBGA package, which typically uses lead-free solder balls (SAC305 or similar).