Dual op-amp in a hermetic ceramic LCC for harsh environments
The 5962-0051208Q2A: Key parametric features include a 6.4 MHz gain-bandwidth product, a 1.6 V/µs slew rate, rail-to-rail output swing, and a supply span from 2.7 V to 6 V. Each channel draws 550 µA supply current and can source or sink 80 mA. The 20-LCCC footprint (8.89 mm x 8.89 mm) is a standard ceramic surface-mount format used in high-reliability, sealed, and high-vibration assemblies.
The AEC-Q100 qualification means this device has passed the automotive-grade stress tests: high-temperature operating life, temperature cycling, moisture sensitivity, and ESD robustness. The ceramic package also makes it a candidate for avionics, satellite, and downhole instrumentation where hermetic sealing is required.
Package and mounting: 20-CLCC ceramic surface-mount
The 20-CLCC (ceramic leadless chip carrier) package is a hermetic, surface-mount format with gold-plated castellations on the bottom edges. It is designed for reflow soldering onto a ceramic or high-temperature PCB.
Lifecycle and compliance
It is listed as RoHS non-compliant, which is typical for hermetic ceramic packages that use lead-based solder seals and tin-lead terminations. This is a standard compliance posture for high-reliability / defense-grade components — not a defect. For RoHS-required builds, a plastic-packaged alternative would be needed, but the ceramic package is often mandatory for the environmental and reliability requirements of military and aerospace programs.