Ratings that matter for the BOM
The 6.4 MHz gain bandwidth and 1.6 V/µs slew rate are adequate for audio-frequency signal conditioning, sensor amplification, and low-speed control loops — not for video or high-speed ADC drivers. The 550 µA supply current per channel keeps the power budget lean in multi-channel designs. The 80 mA output current per channel can drive modest loads like a headphone or a relay coil directly.
Package and mounting — what to expect
The 8-CDIP (Ceramic Dual In-line Package) is a through-hole, hermetic ceramic body with a 0.300" row spacing and 7.62 mm lead pitch. It is not moisture-sensitive like plastic packages — no bake-out required before assembly. The ceramic construction is standard for high-reliability programs (MIL-STD-883, JAN, DESC) and survives the thermal cycling of avionics and downhole tools. Plan for a 0.100" (2.54 mm) lead pitch on the PCB footprint.
Lifecycle and compliance
It is listed as RoHS non-compliant, which is expected for a hermetic ceramic package; lead-bearing solder finishes are standard for high-reliability and defense applications. The AEC-Q100 qualification confirms it meets automotive stress test requirements, but the ceramic package also satisfies the hermeticity needs of space and military programs.