The 1.5SMC6.8CA R7G delivers 1500 W peak pulse capacity at the 10/1000 µs wave shape, clamping the voltage to 10.5 V maximum at 150 A peak pulse current. That 10.5 V ceiling is what your downstream IC actually sees when a surge or ESD event hits the line — the clamping ratio relative to the 5.8 V standoff defines how much overvoltage margin your protected rail needs to survive a transient without triggering breakdown. The CA suffix marks this as the bidirectional variant — the 5.8 V standoff and 6.46 V minimum breakdown are symmetric in both polarities, which matters if your protection bus sits across a differential signal or an AC-coupled rail where neither side is ground-referenced.
SMC package and thermal headroom for industrial layouts
The DO-214AB (SMC) package is the mid-size SMC footprint — larger pad land area than the SMA (DO-214AC) but tighter than the SMB — which gives a reasonable thermal path to the PCB copper without demanding the full DPAK land for a 1.5 kW device. At 150 A peak pulse the transient thermal impedance matters; verify the recommended land pattern pads are populated with sufficient copper area to absorb the pulse without the junction temp overshooting 150 °C.
Listed as Active by Taiwan Semiconductor Corporation.