Package and board integration
The 1.5KE6.8A A0G: Housed in a DO-201AA (DO-27) axial-lead through-hole package, it mounts into a 1.0mm to 1.3mm diameter hole on the PCB — the lead bend radius should stay above 1.5mm to avoid cracking the glass passivation. The axial lead form factor suits point-to-point wiring or PCB layouts where a low-inductance path from the protected rail to ground is critical; keep the trace length under 10mm from the TVS anode to the supply node.
