STMicroelectronics TMMBAT42FILM, Schottky diode, 30 V DC reverse, 200 mA average rectified, 5 ns trr, DO-213AA glass Mini MELF, surface mount.
| Parameter | Value |
|---|---|
| Mounting | Surface Mount |
| Voltage - DC reverse (Vr) | 30 V |
| Voltage - forward (Vf) (Max) @ if | 1 V @ 200 mA |
| Current - reverse leakage @ vr | 500 nA @ 25 V |
| Current - average rectified | 200mA |
| Operating temperature - junction | -65°C ~ 125°C |
| Speed | Small Signal =< 200mA (Io), Any Speed |
| Package | Tape & Reel (TR); Cut Tape (CT) |
| Technology | Schottky |
| Case | DO-213AA (Glass) |
| Capacitance @ vr, | 7pF @ 1V, 1MHz |
| Reverse recovery time | 5 ns |
Housed in a glass Mini MELF package — surface-mount with metallised end caps. The glass body is hermetic.
Junction temperature range spans -65 to 125 °C, which covers most industrial and some automotive under-hood environments. The reverse leakage at 25 V is 500 nA typ — expect that to rise with temperature, but the Schottky construction keeps it manageable up to the 125 °C ceiling.
Price determines budget fit for BOM line items.
Availability affects production lead time and sourcing urgency.
Engineers and buyers need drop-in alternatives for design flexibility or supply risk.
Designers verify electrical and mechanical specs before committing to the part.
Ensures PCB footprint compatibility, especially for mini MELF packages.
Common question from technicians and engineers upgrading or substituting parts.