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STMicroelectronics TMBYV10-60FILM

STMicroelectronics TMBYV10-60FILM Schottky Diode, 60V 1A

MPNTMBYV10-60FILM
End of Life

STMicroelectronics TMBYV10-60FILM Schottky diode, 60 V reverse, 1 A forward, fast recovery ≤500 ns, DO-213AB MELF package, surface mount, ROHS3 compliant.

$0.58Ref. price · indicative, final on quote
PackagingDO-213AB, MELF
RoHSROHS3 Compliant
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

TMBYV10-60FILM specifications
ParameterValue
MountingSurface Mount
Voltage - DC reverse (Vr)60 V
Voltage - forward (Vf) (Max) @ if700 mV @ 1 A
Current - reverse leakage @ vr500 µA @ 60 V
Current - average rectified1A
Operating temperature - junction-65°C ~ 125°C
SpeedFast Recovery =< 500ns, > 200mA (Io)
PackageTape & Reel (TR); Cut Tape (CT)
TechnologySchottky
CaseDO-213AB, MELF

Product details

Fast-recovery Schottky for switching supplies

The STMicroelectronics TMBYV10-60FILM is a 60 V, 1 A Schottky rectifier rated for fast recovery (≤500 ns at >200 mA), making it a fit for high-frequency rectification in DC-DC converters, flyback diodes, and OR-ing circuits rather than 50/60 Hz line rectification where recovery time is irrelevant.

The 60 V reverse voltage (Vr) and 1 A average forward current (Io) define the application window: this diode suits 12 V, 24 V, and 48 V rails with adequate derating, but not 60 V rails where the margin disappears. Forward voltage is 700 mV max at 1 A, which sets the conduction loss at that current. Reverse leakage is 500 µA at 60 V – a typical Schottky trade-off: higher leakage than a PN-junction, but lower Vf. At elevated junction temperatures leakage rises and can dominate the thermal budget if the diode runs near its 125 °C limit.

MELF package – footprint and rework

The DO-213AB MELF (Metal Electrode Leadless Face) package is a cylindrical body with metallised end caps – no leads, no gull-wings. The pad layout must match the MELF footprint (wider than an SOD-123 pad) to avoid tombstoning during reflow. The cylindrical shape can roll during placement if the vacuum nozzle is not centred; a cut-tape or tray feed is more reliable than loose bulk.

ROHS3 compliant.

Frequently asked questions

TMBYV10-60FILM datasheet PDF

Engineers need to verify electrical characteristics and mechanical dimensions before design-in.

Where to buy TMBYV10-60FILM

Sourcing buyers must find authorized distributors to purchase the exact part for production.

TMBYV10-60FILM price

Budgeting BOM cost requires current market pricing from multiple suppliers.

TMBYV10-60FILM equivalent or replacement

If the part is obsolete or unavailable, cross-reference is needed to maintain BOM compatibility.

What is the package of TMBYV10-60FILM

Footprint verification is critical for PCB layout, especially for MELF packages.

TMBYV10-60FILM in stock lead time

Production schedules depend on real-time availability and lead time to avoid delays.