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STMicroelectronics T835H-6G — Discrete Semiconductors

STMicroelectronics T835H-6G Triac, 600 V, 8 A, Snubberless

MPNT835H-6G
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STMicroelectronics T835H-6G Snubberless™ Alternistor triac, 600 V off-state, 8 A RMS on-state, 35 mA gate trigger, D2PAK surface-mount package, -40°C to 150°C junction temperature.

$0.4862Ref. price · indicative, final on quote
STMicroelectronics T835H-6G datasheet (PDF)
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

T835H-6G specifications
ParameterValue
SeriesSnubberless™
Triac typeAlternistor - Snubberless
MountingSurface Mount
Voltage - off state600 V
Voltage - gate trigger (Vgt)1 V
Current - hold (Ih)35 mA
Current - gate trigger (Igt)35 mA
Current - on state (It (RMS))8 A
Current - non rep. surge 50, 60Hz80A, 84A
Operating temperature-40°C~150°C(TJ)
PackageTube
ConfigurationSingle
CaseTO-263-3, D²Pak (2 Leads + Tab), TO-263AB

Product details

The STMicroelectronics T835H-6G is a Snubberless™ Alternistor triac rated for 600 V off-state voltage and 8 A RMS on-state current, housed in a D2PAK surface-mount package. The Snubberless design means it commutates inductive loads without an external RC snubber — a real BOM simplification for motor, valve, and transformer drives where the classic triac would need the extra network to avoid false triggering on dV/dt. The 35 mA gate trigger current (Igt max) is a standard logic-level threshold, compatible with optocoupler or MCU-driven gate drive circuits. The 80 A / 84 A non-repetitive surge rating (50/60 Hz) handles the cold-start inrush of incandescent lamps or capacitive loads without exceeding the device's SOA.

The 150°C Tj ceiling gives thermal headroom for continuous 8 A conduction without forced airflow, provided the D2PAK tab is properly soldered to a copper plane for heat spreading.

Frequently asked questions

What is the difference between T835H-6G and T835H-6F?

The T835H-6G and T835H-6F share the same 600 V, 8 A Snubberless Alternistor die. The difference is the package: the -6G variant is the D2PAK (TO-263) surface-mount package, while the -6F variant is typically the TO-220FP fully isolated through-hole package. The choice depends on your mounting and thermal management approach — D2PAK for reflow assembly and PCB heat sinking, TO-220FP for bolt-down to a heatsink.