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STMicroelectronics STPSC8H065G2Y-TR — Discrete Semiconductors

STPSC8H065G2Y-TR SiC Schottky Diode, 650 V 8 A, AEC-Q101

MPNSTPSC8H065G2Y-TR
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STMicroelectronics STPSC8H065G2Y-TR, SiC Schottky diode, 650 V, 8 A, zero reverse recovery time, AEC-Q101, D2PAK HV package, -40°C to 175°C junction.

$3.8000Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

STPSC8H065G2Y-TR specifications
ParameterValue
SeriesECOPACK®2
MountingSurface Mount
Voltage - DC reverse (Vr)650 V
Voltage - forward (Vf) (Max) @ if1.65 V @ 8 A
Current - reverse leakage @ vr80 µA @ 650 V
Current - average rectified8A
Operating temperature - junction-40°C ~ 175°C
GradeAutomotive
SpeedNo Recovery Time > 500mA (Io)
PackageTape & Reel (TR) Cut Tape (CT)
TechnologySiC (Silicon Carbide) Schottky
QualificationAEC-Q101
CaseTO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Capacitance @ vr,414pF @ 0V, 1MHz
Reverse recovery time0 ns

Product details

650 V SiC Schottky with zero-recovery switching

The STPSC8H065G2Y-TR is a silicon-carbide Schottky diode from STMicroelectronics, rated 650 V reverse voltage and 8 A average rectified current. The zero reverse recovery time eliminates the switching-loss term that dominates in silicon fast-recovery diodes, making this part a direct fit for hard-switched PFC stages, DC-DC converters, and traction inverters where every watt of switching loss hits the thermal budget.

The AEC-Q101 qualification places this diode in the automotive-grade tier. The D2PAK HV surface-mount package is the high-voltage variant with extended creepage distance between the tab and the leads.

Forward drop and leakage at the operating point

Maximum forward voltage is 1.65 V at 8 A. Reverse leakage is 80 µA at 650 V.

The ECOPACK2 designation confirms RoHS compliance and no halogens above the threshold.

Frequently asked questions

Is STPSC8H065G2Y-TR AEC-Q101 qualified?

Yes, it is AEC-Q101 qualified, which means it has passed the automotive-grade stress tests required for deployment in under-hood and chassis-domain electronics.