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STMicroelectronics STPSC6H065DLF — Discrete Semiconductors

STPSC6H065DLF SiC Schottky Diode, 650 V 6 A, Zero Recovery

MPNSTPSC6H065DLF
Active

STMicroelectronics STPSC6H065DLF SiC Schottky diode, ECOPACK®2 series, 650 V reverse voltage, 6 A average rectified current, zero reverse recovery time, 175 °C junction temperature, PowerFlat 8x8 HV surface-mount package.

$2.9900Ref. price · indicative, final on quote
Packaging8-PowerVDFN
SeriesECOPACK®2
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

STPSC6H065DLF specifications
ParameterValue
SeriesECOPACK®2
MountingSurface Mount
Voltage - DC reverse (Vr)650 V
Voltage - forward (Vf) (Max) @ if1.55 V @ 6 A
Current - reverse leakage @ vr60 µA @ 650 V
Current - average rectified6A
Operating temperature - junction-40°C ~ 175°C
SpeedNo Recovery Time > 500mA (Io)
PackageTape & Reel (TR) Cut Tape (CT)
TechnologySiC (Silicon Carbide) Schottky
Case8-PowerVDFN
Capacitance @ vr,350pF @ 0V, 1MHz
Reverse recovery time0 ns

Product details

SiC Schottky — the part that kills the recovery tail

The STPSC6H065DLF is a silicon-carbide Schottky diode rated for 650 V reverse and 6 A forward continuous current. That makes it the right choice for hard-switched PFC stages and resonant converters where a fast-recovery Si diode would leave a recovery tail that heats the junction.

Junction temperature and package — the thermal budget

The junction temperature range extends from -40 °C to 175 °C, which is wider than most ultrafast silicon diodes and gives headroom in high-ambient or tightly enclosed power stages. The part comes in an 8-PowerVDFN package (PowerFlat 8x8 HV) — the large copper pad under the die sinks heat into the PCB plane, so the board layout and via count directly set the thermal resistance.

Forward drop and leakage — what to expect at full load

Maximum forward voltage is 1.55 V at 6 A — the conduction loss at rated current is about 9.3 W, which the package must shed. Reverse leakage is 60 µA at 650 V, a typical SiC figure that rises with temperature but stays well below the leakage of a comparably rated ultrafast silicon diode at high junction temperatures.

Frequently asked questions

Can the STPSC6H065DLF replace the STPSC6H065D?

The STPSC6H065DLF is the surface-mount PowerFlat version of the same die; the STPSC6H065D is typically a through-hole or different package variant. Pin compatibility depends on the board footprint — the PowerFlat 8x8 HV has a different pad layout than a TO-220 or D²PAK. Check the mechanical drawing before substituting.