Board-fit and thermal note for the PowerFlat package
The STPS6M100DEE-TR: Solder the pad to a copper plane on the PCB; the datasheet layout recommendation (page 7 of the ST datasheet) calls for a 4x4 mm solder-paste aperture and at least four thermal vias to the inner ground layer. Without that plane, the junction-to-ambient thermal resistance rises above the 150°C max junction temperature rating, and the 6 A average current at 780 mV forward drop will push the die past its absolute-maximum limit.