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STMicroelectronics STPS30M100ST — Discrete Semiconductors

STPS30M100ST Schottky Diode, 100V 30A, TO-220-3

MPNSTPS30M100ST
Active

STMicroelectronics STPS30M100ST Schottky diode, 100V reverse voltage, 30A average rectified current, TO-220-3 through-hole package, ROHS3 compliant.

$1.7400Ref. price · indicative, final on quote
PackagingTO-220-3
RoHSROHS3 Compliant
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

STPS30M100ST specifications
ParameterValue
Diode typeSchottky
MountingThrough Hole
Voltage - DC reverse (Vr)100 V
Voltage - forward (Vf) (Max) @ if800 mV @ 30 A
Current - reverse leakage @ vr175 µA @ 100 V
Current - average rectified30A
Operating temperature - junction150°C(Max)
SpeedFast Recovery =< 500ns, > 200mA (Io)
PackageTube
CaseTO-220-3

Product details

100V 30A Schottky — the OR-ing and rectifier slot

The STPS30M100ST is a 100V, 30A Schottky barrier rectifier in a TO-220-3 through-hole package from STMicroelectronics. It is part of the STPS30 family of power Schottky diodes designed for low forward voltage drop and fast switching. Rated 100 V DC reverse maximum and 30 A average rectified current, this diode fits output OR-ing, freewheeling, and polarity-protection slots in 12V to 48V bus architectures where the 100V margin covers transients without avalanche stress.

Forward drop and leakage — the thermal budget

Forward voltage is 800 mV maximum at 30 A — the conduction loss at full load is 24 W, which sets the heatsink requirement. Reverse leakage is 175 µA at 100 V and 25°C junction. This doubles roughly every 10°C, so at 125°C junction the leakage approaches 28 mA — high enough to cause thermal runaway if the heatsink is undersized or the diode is paralleled without current-sharing resistors.

Through-hole TO-220 — heatsink and board integration

The TO-220-3 package (supplier device package TO-220) has a metal tab that is electrically common with the cathode. The tab must be isolated from the heatsink with a thermal pad or mica washer unless the heatsink itself is at cathode potential. Through-hole mounting means the diode stands off the board — the leads are formed for a 0.100-inch pitch pattern. The tab hole in the PCB should be plated through to the bottom-side copper pour for thermal transfer, and the leads should be soldered with a wave or selective-solder process.

Frequently asked questions

Will STPS30M100ST drop into a panel that was specified around STPS30M100SFP without rewiring?

No — the STPS30M100SFP is in a TO-220FP (fully insulated) package, while the STPS30M100ST is a standard TO-220 with an exposed metal tab. The pinout is the same (cathode tab, anode pin 2), but the footprint and heatsink isolation method differ. A board designed for the SFP's full-pack tab cannot accept the ST without adding an isolation pad or changing the heatsink interface.