Skip to main content
STMicroelectronics STPS1230SF — Discrete Semiconductors

STPS1230SF Schottky Diode, 30V 12A, TO-277A, Active

MPNSTPS1230SF
Active

STMicroelectronics STPS1230SF, ECOPACK®2 Schottky rectifier, 30 V reverse, 12 A average, fast recovery < 500 ns, TO-277A (SMPC) surface-mount package.

$0.8000Ref. price · indicative, final on quote
PackagingTO-277, 3-PowerDFN
RoHSROHS3 Compliant
SeriesECOPACK®2
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

STPS1230SF specifications
ParameterValue
SeriesECOPACK®2
MountingSurface Mount
Voltage - DC reverse (Vr)30 V
Current - reverse leakage @ vr360 µA @ 30 V
Current - average rectified12A
Operating temperature - junction150°C (Max)
SpeedFast Recovery =< 500ns, > 200mA (Io)
PackageTape & Reel (TR) Cut Tape (CT)
TechnologySchottky
CaseTO-277, 3-PowerDFN

Product details

12 A Schottky in a TO-277A footprint

The STPS1230SF is a 30 V, 12 A Schottky rectifier from STMicroelectronics in the ECOPACK®2 series, housed in a TO-277A (SMPC) surface-mount package. With a fast recovery speed under 500 ns, it handles the reverse-recovery losses in a switched-mode power supply or a DC-DC converter output stage without forcing a slower diode's thermal penalty.

Reverse leakage and junction temperature

Reverse leakage is 360 µA at the rated 30 V blocking voltage. At 150°C maximum junction temperature, the leakage current rises exponentially — the thermal design must budget this self-heating, especially in a compact TO-277A pad where the copper area under the cathode tab sets the thermal resistance to ambient.

Active lifecycle and compliance

ROHS3 compliant, which covers the full RoHS exemption scope including lead-free soldering profiles. The ECOPACK®2 designation confirms the package is halogen-free per ST's internal specification.

Frequently asked questions

What is the maximum junction temperature for STPS1230SF?

The maximum junction temperature is 150°C. The reverse leakage current increases with temperature, so the thermal pad area on the PCB must be sized to keep the junction below this limit under full load.