STP9N65M2

STMicroelectronics · MDmesh™ Series

STMicroelectronics MDmesh™ STP9N65M2, N-Channel MOSFET, 650 V Vdss, 5 A Id, 900 mOhm Rds(on) at 10 V, 10 nC Qg, TO-220-3, Through Hole, 150°C TJ.

STMicroelectronics STP9N65M2
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Technical specifications

STP9N65M2 specifications
Parameter / AttributeSpecification / Value
SeriesMDmesh™
FET typeN-Channel
MountingThrough Hole
Drain to source voltage650 V
Drive voltage (Max rds on, min rds on)10V
Current - continuous drain (Id) @ 25°C5A (Tc)
Power dissipation60W (Tc)
Operating temperature150°C (TJ)
PackageTube
Vgs±25V
TechnologyMOSFET (Metal Oxide)
CaseTO-220-3
Vgs(th) (Max) @ id4V @ 250µA
Rds on (Max) @ id, vgs900mOhm @ 2.5A, 10V
Gate charge (Qg) (Max) @ vgs10 nC @ 10 V
Input capacitance (Ciss) (Max) @ vds315 pF @ 100 V

Technical details

650 V N-channel in a TO-220 — what the bench sees

Gate charge is 10 nC typical at 10 V — low enough that a standard gate-drive transformer or a simple driver IC handles the switching without excessive cross-conduction loss.

On-resistance and gate charge — the switching loss trade-off

Rds(on) at 900 mOhm is specified at 2.5 A and 10 V gate voltage — the 10 V drive level is the standard for logic-level gate drivers. The 10 nC total gate charge at 10 V means the driver needs to source only about 10 nC per switching cycle — at 100 kHz switching frequency that is 1 mA average drive current, well within the capability of a TO-220 package's thermal budget.

ROHS3 compliant per. The base product number STP9N65 covers a family of voltage and current variants; the M2 suffix identifies the MDmesh™ generation.

Through-hole TO-220 — thermal and mechanical fit

The TO-220-3 through-hole package (mounting hole pattern standard to the JEDEC outline) allows a heatsink to be bolted directly to the tab. Maximum power dissipation is 60 W at case temperature — the actual dissipation in a 650 V, 5 A application is limited by the Rds(on) and switching losses, not the package ceiling.

STP9N65M2
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