Input capacitance is 910 pF at Vds = 25 V.
Thermal and package constraints
Maximum power dissipation is 110 W at case temperature Tc, derated to zero at 150°C junction. The TO-220-3 through-hole package (supplier device package TO-220) requires a heatsink for any continuous load above a few watts; the junction-to-case thermal path dominates the thermal budget.
