STP33N60M6

STMicroelectronics

STMicroelectronics STP33N60M6, MDmesh™ M6 N-Channel MOSFET, 600 V Vdss, 125 mOhm Rds(on) @ 12.5 A, 10 V, 25 A continuous drain, 33.4 nC gate charge, TO-220-3 through-hole, -55°C to 150°C junction.

STMicroelectronics STP33N60M6
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Technical specifications

STP33N60M6 specifications
Parameter / AttributeSpecification / Value
SeriesMDmesh™ M6
FET typeN-Channel
MountingThrough Hole
Drain to source voltage600 V
Drive voltage (Max rds on, min rds on)10V
Current - continuous drain (Id) @ 25°C25A (Tc)
Power dissipation190W (Tc)
Operating temperature-55°C ~ 150°C (TJ)
PackageTube
Vgs±25V
TechnologyMOSFET (Metal Oxide)
CaseTO-220-3
Vgs(th) (Max) @ id4.75V @ 250µA
Rds on (Max) @ id, vgs125mOhm @ 12.5A, 10V
Gate charge (Qg) (Max) @ vgs33.4 nC @ 10 V
Input capacitance (Ciss) (Max) @ vds1515 pF @ 100 V

Technical details

600 V N-channel in the MDmesh M6 family

The STP33N60M6 is a 600 V N-channel power MOSFET from STMicroelectronics' MDmesh™ M6 series, built on a multi-drain mesh vertical process that balances on-resistance and switching speed for high-voltage power conversion.

The input capacitance is 1515 pF at 100 V drain-source — the Miller plateau region is narrow enough that a standard gate-drive IC with a few ohms of external gate resistance can hit the target switching speed without excessive ringing.

On-resistance and conduction loss at the operating point

At that current the conduction loss sits around 12.5 W, well within the 190 W package dissipation limit when the device is bolted to a proper heatsink.

The TO-220-3 package with a metal tab is the standard through-hole format for heatsink mounting. The tab is the drain terminal, so the heatsink pad must be electrically isolated or the entire assembly floats. The 190 W dissipation rating assumes the case is held at 25°C — in a real 85°C ambient, the usable power drops to about 80 W before the junction hits 150°C, so the thermal resistance of the interface pad and heatsink area is the real limiter.

STP33N60M6
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