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STMicroelectronics STP20NM60FP — Discrete Semiconductors

STP20NM60FP N-Channel 600 V 20 A MOSFET, TO-220FP

MPNSTP20NM60FP
Active

STMicroelectronics MDmesh™ N-Channel MOSFET, 600 V Vdss, 20 A Id, 290 mOhm Rds(on) at 10 A, 10 V, TO-220-3 Full Pack, Through Hole, 45 W power dissipation.

$6.7200Ref. price · indicative, final on quote
PackagingTO-220-3 Full Pack
RoHSROHS3 Compliant
SeriesMDmesh™
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

STP20NM60FP specifications
ParameterValue
SeriesMDmesh™
FET typeN-Channel
MountingThrough Hole
Drain to source voltage600 V
Drive voltage (Max rds on, min rds on)10V
Current - continuous drain (Id) @ 25°C20A (Tc)
Power dissipation45W (Tc)
Operating temperature150°C(TJ)
PackageTube
Vgs±30V
TechnologyMOSFET (Metal Oxide)
CaseTO-220-3 Full Pack
Vgs(th) (Max) @ id5V @ 250µA
Rds on (Max) @ id, vgs290mOhm @ 10A, 10V
Gate charge (Qg) (Max) @ vgs54 nC @ 10 V
Input capacitance (Ciss) (Max) @ vds1500 pF @ 25 V

Product details

600 V, 20 A — what the TO-220FP package delivers

The STP20NM60FP: The 290 mOhm maximum on-resistance at 10 A, 10 V gate drive sets the conduction loss floor for a 600 V-class device.

TO-220FP — no insulator needed

The TO-220 Full Pack (TO-220FP) package has a fully isolated metal tab.

Active production — no LTB worry

The part is in the MDmesh™ series, a mature ST power MOSFET platform, so the supply channel is stable.

Frequently asked questions

Can STP20NM60FP replace STP20NM60?

The STP20NM60FP is the full-pack (isolated tab) variant of the STP20NM60, which uses the standard TO-220 (non-isolated) package. The electrical ratings — 600 V Vdss, 20 A Id, 290 mOhm Rds(on) — are the same. The FP version adds the moulded full-pack isolation, so the mounting hole pattern and heatsink interface differ. Pin compatibility is the same three-lead TO-220 footprint, but the tab is electrically isolated on the FP, so the heatsink does not need an insulating pad. Verify the mechanical fit in your enclosure before substituting.