The 480 mOhm Rds(on) and 25 nC gate charge match the original design parameters. The MDmesh II die structure is the same vertical mesh technology; no layout or heatsink change is needed.
TO-220 package — thermal and assembly fit
Through-hole TO-220-3 package with the standard 2.54 mm pitch lead form. The metal tab is the drain terminal and must be electrically isolated or connected to the drain node in the layout. Maximum power dissipation is 90 W at case temperature, but the real thermal limit depends on the heatsink-to-ambient thermal resistance and the ambient air flow. The junction temperature range is -55 to 150 °C, covering industrial and some automotive under-hood environments.