Internal oscillator and brown-out detect/reset are integrated, reducing external BOM count.
132-ball UFBGA — layout and rework notes
The 132-UFBGA package measures 7 mm x 7 mm with a 0.5 mm ball pitch. Surface-mount assembly requires a solder-paste stencil aligned to the ball pattern; X-ray inspection is recommended after reflow to check for head-in-pillow defects. Decouple the Vcc supply with a 100 nF capacitor per supply pin pair, placed as close to the balls as the fan-out vias allow.
