80 MHz Cortex-M4 with FPU — compute headroom for signal chains
WLCSP package — layout and rework considerations
Housed in a 100-ball WLCSP measuring 4.62 x 4.14 mm, this package saves board area but demands careful PCB layout. No exposed thermal pad here — heat dissipation is through the solder balls and the board copper.
Peripheral set — connectivity and analog I/O
Lifecycle status — active, no LTB risk
STMicroelectronics lists the STM32L496VGY6TR as an active product.
