80 MHz Cortex-M4 with 1 MB Flash — memory headroom for field-upgradeable firmware
The STM32L476JGY6TR: The 57 general-purpose I/O lines connect to CANbus, I²C, SPI, Quad-SPI, SAI, USB OTG, and an LCD controller. Two 12-bit DACs and a 16-channel 12-bit ADC handle mixed-signal tasks.
72-WLCSP footprint — board area and rework considerations
Housed in a 72-ball WLCSP measuring 4.41 x 3.76 mm, this package saves significant PCB real estate compared to a QFP or BGA of the same pin count. The wafer-level chip-scale package requires a solder-paste stencil designed for the 0.4 mm pitch and a reflow profile that follows the JEDEC MSL level specified on the reel label. For rework, a hot-air nozzle matched to the package outline and a preheat soak at 125°C reduce the risk of adjacent component disturbance.
The ROHS3 compliance is current.
