STM32L476JEY6TR — ultra-low-power Cortex-M4 with 80 MHz and 512 KB Flash
The 72-WLCSP package (4.41 x 3.76 mm) saves board area but demands careful PCB layout for the fine-pitch ball array. Connectivity includes CANbus, I²C, SPI, UART/USART, USB OTG, QSPI, and SAI — enough for sensor hubs, motor-control interfaces, or human-machine-interface panels. The 57 I/O lines and the integrated LCD driver expand the application space to segmented displays and keypads.
72-WLCSP — footprint and layout considerations
The 72-WLCSP package (4.41 x 3.76 mm) requires a via-in-pad or microvia process to route the 57 I/O and supply balls.
