144-ball UFBGA — footprint and assembly realities
That's a fine-pitch BGA — the board house needs via-in-pad or microvias to route all 114 I/O out of the inner rows. The exposed center pad is a thermal and electrical ground; stitch it to the ground plane with at least nine vias to keep the junction temperature under control during sustained 80 MHz operation.
Industrial temperature range — where it fits
It belongs in factory automation, outdoor telecom, motor drives, and instrumentation enclosures.
ST lists the STM32L471ZGJ6 as an active product.