Housed in a 132-ball UFBGA (7x7 mm), this is a fine-pitch BGA that requires controlled reflow and X-ray inspection. The compact footprint suits space-constrained designs, but the 0.5 mm ball pitch calls for a capable PCB fab and assembly house.
Lifecycle and procurement posture
There is no NRND or LTB notice, so it remains qualified for new designs and volume production.
