49-ball WLCSP — footprint trade-offs
This variant ships in a 49-ball wafer-level chip-scale package (WLCSP) measuring 3.14 x 3.13 mm, the smallest footprint in the STM32L443 family. The trade-off: WLCSP requires tighter PCB land patterns, controlled solder-paste volume, and X-ray inspection after reflow. It is not hand-solderable — plan for an automated SMT line. The 83 I/O count is available in this package, so peripheral-rich designs do not lose GPIO density despite the tiny body.
Brown-out detect, DMA, and a watchdog timer are on-chip, reducing external supervisor IC count.
