Skip to main content
STMicroelectronics STM32L053R8H6 — Microcontrollers & Processors (MCU / MPU / DSP)

STM32L053R8H6 STM32L0 MCU, ARM Cortex-M0+, 32 MHz

MPNSTM32L053R8H6
Active

STMicroelectronics STM32L0 series STM32L053R8H6, ARM Cortex-M0+ 32-bit MCU, 32 MHz, 64 KB Flash, 8K x 8 RAM, 2K x 8 EEPROM, 51 I/O, 1.65 V to 3.6 V supply, -40°C to 85°C, 64-TFBGA (5x5 mm) tray.

$5.1300Ref. price · indicative, final on quote
Packaging64-TFBGA
RoHSROHS3 Compliant
SeriesSTM32L0
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

STM32L053R8H6 specifications
ParameterValue
SeriesSTM32L0
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.65V ~ 3.6V
Operating temperature-40°C ~ 85°C (TA)
Speed32MHz
PackageTray
RAM size8K x 8
Core size32-Bit Single-Core
EEPROM size2K x 8
PeripheralsBrown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
ConnectivityI²C, IrDA, SPI, UART/USART, USB
Number of i (O)51
Core processorARM® Cortex®-M0+
Case64-TFBGA
Data convertersA/D 16x12b; D/A 1x12b
Program memory size64KB (64K x 8)

Product details

The STM32L053R8H6 is an ultra-low-power 32-bit microcontroller from STMicroelectronics' STM32L0 series, built around an ARM Cortex-M0+ core clocked at 32 MHz.

Memory and peripheral mix for a sensor-node design

The 2 KB EEPROM holds calibration constants and configuration data that survive power loss — no external serial EEPROM needed. On-chip peripherals include a 12-bit ADC with 16 channels, a 12-bit DAC, DMA, a real-time LCD driver, and a USB interface.

Package and assembly considerations for the 64-TFBGA

The supplier device package is 64-TFBGA (5x5). The surface-mount footprint is compatible with standard BGA land patterns for a 64-ball, 0.5 mm pitch array.

Frequently asked questions

What are the main differences between STM32L053R8H6 and STM32L053R8T6?

The STM32L053R8H6 is packaged in a 64-TFBGA (5x5 mm), while the STM32L053R8T6 uses an LQFP-64 package. The BGA variant saves board area but requires a more controlled assembly process. Both share the same core, memory, and peripheral set.