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STMicroelectronics STM32F777IIT7 — Microcontrollers & Processors (MCU / MPU / DSP)

STM32F777IIT7 ARM Cortex-M7 MCU, 216MHz, 2MB Flash, 176-LQFP

MPNSTM32F777IIT7
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STMicroelectronics STM32F7 series ARM Cortex-M7 MCU, STM32F777IIT7, 216MHz, 2MB Flash, 512KB RAM, 132 I/O, Ethernet, USB OTG, 1.7–3.6V, -40 to 105°C, 176-LQFP (24×24), tray.

$18.4328Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

STM32F777IIT7 specifications
ParameterValue
SeriesSTM32F7
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.7V ~ 3.6V
Operating temperature-40°C~105°C(TA)
Speed216MHz
PackageTray
RAM size512K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART/USART, USB OTG
Number of i (O)132
Core processorARM® Cortex®-M7
Case176-LQFP
Data convertersA/D 24x12b; D/A 2x12b
Program memory size2MB (2M x 8)

Product details

It delivers the DSP and FPU throughput needed for real-time control, audio processing, and communications gateway designs without an external memory bus for code storage. The 216 MHz core speed, combined with the Cortex-M7's single-cycle multiply-accumulate and hardware floating-point unit, gives this part a deterministic compute budget for motor-field-oriented control loops, audio codec pipelines, and protocol-stack processing. The 2 MB Flash density supports large firmware images with OTA update staging, while the 512 KB RAM handles Ethernet TCP/IP buffers, USB descriptor tables, and display framebuffers without external SRAM. Operating temperature spans -40 to 105°C, the industrial-grade range that covers outdoor telecom cabinets, factory-floor motor drives, and under-hood automotive auxiliary modules.

176-LQFP footprint and I/O count

Housed in a 176-LQFP package (24×24 mm body), the STM32F777IIT7 brings out 132 I/O pins. The fine-pitch (0.5 mm) QFP requires a multilayer PCB with dedicated power and ground planes to manage the simultaneous switching noise from the high-speed I/O banks. Decoupling should follow the STM32F7 hardware development guide: one 100 nF ceramic per VDD/VSS pair plus a bulk 4.7 µF to 10 µF on each supply rail. The 132 I/O count, combined with the peripheral multiplexing, allows parallel LCD interfaces, external memory buses (EBI/EMI), and multiple serial ports to coexist. The 24×24 mm package footprint is compatible with standard QFP soldering profiles;

Connectivity: Ethernet, USB OTG, and serial interfaces

The STM32F777IIT7 integrates a 10/100 Ethernet MAC with dedicated DMA and an internal PHY interface (MII/RMII), plus a USB OTG controller that supports host, device, and OTG modes. These two interfaces make this MCU a natural fit for industrial IoT gateways, protocol converters, and edge nodes that bridge fieldbus networks to Ethernet or USB-connected hosts. Additional connectivity includes CANbus, I²C, SPI, UART/USART, SAI (serial audio), SPDIF, QSPI, and SDIO. The QSPI interface can execute code from external Flash at 104 MHz, useful when the 2 MB internal Flash is fully consumed by the application image.

The base product number is STM32F777, which shares pin-compatibility with the STM32F767 series in the same 176-LQFP package. If a design needs to scale memory or peripheral count, the STM32F7 family offers density and feature variants that can drop into the same footprint with firmware adjustments.

Frequently asked questions

Does STM32F777IIT7 have Ethernet and USB OTG?

Yes, the STM32F777IIT7 integrates a 10/100 Ethernet MAC with MII/RMII interface and a USB OTG controller supporting host, device, and OTG modes, along with CANbus, I²C, SPI, UART, SAI, SPDIF, QSPI, and SDIO.

Is STM32F777IIT7 compatible with STM32F767?

The STM32F777 and STM32F767 series share pin-compatibility in the same 176-LQFP package. Designs can migrate between them with firmware adjustments, though peripheral and memory differences should be verified against the respective datasheets.