216 MHz Cortex-M7 — the core that sets the performance tier
It packs 2 MB of Flash and 512 KB of SRAM on a single die, targeting applications that need DSP-class number crunching, high-speed connectivity, and real-time control without an external memory bus. Typical deployments include industrial motor drives, multi-protocol gateways (Ethernet + CAN + USB), high-end HMI panels with graphical displays, and audio processing chains where the Cortex-M7's single-cycle multiply-accumulate and hardware FPU make a measurable difference in loop throughput.
Connectivity and peripherals — Ethernet, dual CAN, and 168 I/O
The 168 general-purpose I/O pins give ample headroom for parallel displays, external memory buses (EBI/EMI), and sensor arrays. The built-in LCD controller and TFT driver support direct connection to a parallel RGB panel, simplifying the BOM for HMI designs that would otherwise need an external graphics controller.
216-ball TFBGA — routing and thermal considerations
Housed in a 216-ball TFBGA (13x13 mm body), this package demands a multi-layer PCB with microvias or blind vias to route the dense ball array. The fine pitch (0.8 mm typical) means the board house needs capability for via-in-pad or at least a 4-layer stack-up. On the positive side, the BGA offers excellent thermal dissipation through the central ground balls — useful when the core is running sustained DSP loads at 216 MHz in a 105°C ambient.
STMicroelectronics lists the STM32F767NIH7 as Active. The ROHS3 compliance covers the EU RoHS exemption landscape through 2024 and beyond.