216 MHz Cortex-M7 with 1 MB Flash — what that buys you
216-TFBGA — rework and layout reality
The package is a 216-ball TFBGA, 13x13 mm body. That is a fine-pitch BGA — you need a four-layer PCB minimum, controlled impedance on the Ethernet and USB traces, and a stencil designed for 0.4 mm or 0.5 mm ball pitch. In the rework bay, hot-air profile matters: preheat the board to 100–110°C before the top nozzle ramp, and use a flux that wicks under the balls without leaving residue that traps moisture.
That means ST is still manufacturing it, no last-time-buy notice has been issued, and it remains eligible for new design-ins. For a production BOM, this is the green light — no forced redesign on the horizon from this part alone.