Connectivity and analog integration for industrial BOM consolidation
The peripheral set on this part reduces the need for external interface chips. Connectivity includes Ethernet MAC, CAN 2.0B, USB OTG (host/device), multiple SPI and I²C buses, SDIO for external storage, and SAI for audio serial interfaces. The 114 general-purpose I/O pins, many with 5 V tolerance, give headroom for parallel LCD data buses and keypad matrices.
169-UFBGA (7x7 mm) — footprint and rework considerations
This MCU comes in a 169-ball ultra-fine-pitch BGA (169-UFBGA) measuring 7x7 mm. The 7x7 mm body makes hot-air reballing feasible with a stencil, but inspection requires X-ray for hidden solder joints.
