STM32F446ZEH6TR STMicroelectronics ARM Cortex-M4 MCU, 180MHz, 512KB Flash
STMicroelectronics STM32F4 series, 32-bit ARM Cortex-M4 MCU; STM32F446ZEH6TR in 144-UFBGA (7x7 mm) Tape & Reel; 180MHz core, 512KB FLASH, 128KB RAM, 114 I/O, 1.7–3.6V supply, -40°C to 85°C; rich peripheral set including CANbus, USB OTG, SPI, I²C, 24-channel 12-bit ADC.
- 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
- Date & lot codes on quoteStated per line before you commit; label photos on request.
- MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
- PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.
Specifications
| Parameter | Value |
|---|---|
| Series | STM32F4 |
| Mounting type | Surface Mount |
| Oscillator type | Internal |
| Program memory type | FLASH |
| Voltage - supply (Vcc (Vdd)) | 1.7V ~ 3.6V |
| Operating temperature | -40°C~85°C(TA) |
| Speed | 180MHz |
| Package | Tape & Reel (TR) |
| RAM size | 128K x 8 |
| Core size | 32-Bit Single-Core |
| Peripherals | Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT |
| Connectivity | CANbus, EBI/EMI, I²C, IrDA, LINbus, SAI, SD, SPDIF-Rx, SPI, UART/USART, USB, USB OTG |
| Number of i (O) | 114 |
| Core processor | ARM® Cortex®-M4 |
| Case | 144-UFBGA |
| Data converters | A/D 24x12b; D/A 2x12b |
| Program memory size | 512KB (512K x 8) |
Frequently asked questions
Can I drop firmware from an STM32F407 project onto the STM32F446ZEH6TR without changes?
Not directly — the peripheral base addresses and clock-tree assignments differ between the STM32F407 and STM32F446 in the STM32F4 HAL. Expect re-muxing of SPI, CAN, and I²C pin assignments and validation of clock configuration before the application boots cleanly.
Does the part ship pre-balled and what reel quantity should I expect?
The 144-UFBGA ships on Tape & Reel (TR). Confirm ball metallurgy and exact reel quantity with your distributor at RFQ — BGA packages in this pitch range require JEDEC-compliant pocket dimensions and may need X-ray inspection after placement, which affects the assembly handoff documentation you should request from the supplier.