180 MHz Cortex-M4 with 2 MB Flash — what this MCU delivers
The 140 I/O lines are mapped to a 176-ball UFBGA package (10x10 mm), which packs a high pin count into a compact footprint — useful for designs that need parallel bus interfaces (EBI/EMI), Ethernet, dual CAN, USB OTG, and multiple SPI/I²C/UART peripherals simultaneously.
Package and mounting — UFBGA rework considerations
The 176+25UFBGA (10x10 mm) is a fine-pitch ball-grid array. The package has no exposed thermal pad; heat dissipation relies on the PCB copper plane and via stitching under the BGA.
On-chip peripherals include DMA, PWM, WDT, I²S, and POR/Brown-out detect. The connectivity block covers CANbus, Ethernet, USB OTG, and an external memory interface (EBI/EMI) that can handle SRAM, NOR Flash, or NAND Flash. This peripheral mix suits applications like industrial PLCs, motor drives with encoder feedback, and IoT gateways that aggregate sensor data and push it over Ethernet or CAN.