140 I/O and the full peripheral set — Ethernet, CAN, DCMI, USB OTG
With 140 I/O lines brought out to the 176+25 UFBGA package, this MCU can drive a parallel LCD, a camera interface (DCMI), and an external bus (EBI/EMI) alongside the usual serial interfaces. The connectivity list includes Ethernet MAC, two CAN buses, multiple SPI/I²C/UART channels, and USB OTG — enough for a board that acts as a protocol bridge or a motor-drive controller with fieldbus. The two 12-bit DACs and 24-channel 12-bit ADC cover analog feedback paths without an external converter.
No NRND or last-time-buy notices apply to this order code. For production planning, the base product number STM32F417 spans multiple density and package variants, so a BGA-to-LQFP migration within the same die family is possible without a full firmware rewrite if board space constraints change.
176+25 UFBGA — routing the 10x10 mm BGA
The package is a 176+25 UFBGA measuring 10x10 mm with a 0.5 mm ball pitch. Surface-mount only. The 140 GPIOs mean a multi-layer PCB with via-in-pad or microvia routing is typical for keeping the board area compact. Operating temperature covers -40 to 85 °C, which suits industrial enclosures and outdoor telecom cabinets but not extended under-hood automotive (that would need the -40 to 125 °C grade).