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STMicroelectronics STM32F412ZEJ3 — Microcontrollers & Processors (MCU / MPU / DSP)

STM32F412ZEJ3 STM32F4 ARM Cortex-M4 MCU, 100 MHz

MPNSTM32F412ZEJ3
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STMicroelectronics STM32F4 series, STM32F412ZEJ3, ARM Cortex-M4 32-bit MCU, 100 MHz, 512 KB Flash, 256K x 8 RAM, 114 I/O, CANbus/EBI/EMI/I²C/IrDA/LINbus/MMC/SD/SDIO/QSPI/SPI/UART/USART/USB OTG, 1.7 V to 3.6 V, -40°C to 125°C, 144-UFBGA.

$7.5250Ref. price · indicative, final on quote
STMicroelectronics STM32F412ZEJ3 datasheet (PDF)
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

STM32F412ZEJ3 specifications
ParameterValue
SeriesSTM32F4
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.7V ~ 3.6V
Operating temperature-40°C ~ 125°C (TA)
Speed100MHz
PackageTray
RAM size256K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
ConnectivityCANbus, EBI/EMI, I²C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB OTG
Number of i (O)114
Core processorARM® Cortex®-M4
Case144-UFBGA
Data convertersA/D 16x12b
Program memory size512KB (512K x 8)

Product details

It packs 512 KB of Flash and 256 KB of RAM, giving firmware room for real-time control stacks, communications protocols, and moderate data buffering without external memory.

Industrial temperature grade and BGA package — layout and handling notes

If you are dual-sourcing, the base product number STM32F412 covers multiple density and package variants — a pin-compatible sibling with different Flash/RAM may serve as a second-source option within the same family, though no official cross-reference is recorded here.

Frequently asked questions

How does STM32F412ZEJ3 compare to STM32F411?

The STM32F412ZEJ3 adds more RAM (256 KB vs 128 KB) and additional connectivity like QSPI and CAN, making it a better fit for designs needing richer peripheral integration. Both share the same Cortex-M4 core and 100 MHz speed, but the F412 targets applications requiring more memory and interface headroom.