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STMicroelectronics STM32F411VEH6U — Microcontrollers & Processors (MCU / MPU / DSP)

STM32F411VEH6U ARM Cortex-M4 MCU, 100 MHz, 512 KB Flash

MPNSTM32F411VEH6U
Active

STMicroelectronics STM32F4 series, ARM Cortex-M4, 32-bit Single-Core, 100MHz, 512KB (512K x 8) FLASH, 128K x 8 RAM, 100-UFBGA.

$11.0100Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

STM32F411VEH6U specifications
ParameterValue
SeriesSTM32F4
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.7V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed100MHz
PackageTray
RAM size128K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
ConnectivityI²C, IrDA, LINbus, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Number of i (O)81
Core processorARM® Cortex®-M4
Case100-UFBGA
Data convertersA/D 16x12b
Program memory size512KB (512K x 8)

Product details

What the 100 MHz Cortex-M4 and 512 KB Flash mean for your BOM

The STM32F411VEH6U is an STMicroelectronics ARM Cortex-M4 MCU in the STM32F4 family, clocked at 100 MHz with a single-precision FPU that handles DSP and control loops without a separate coprocessor. The 100-UFBGA package (7x7 mm) keeps the board area tight, but the fine-pitch BGA means a four-layer PCB with microvias is the practical floor for routing the 81 I/O and USB OTG signals.

The internal oscillator means you can bring up the core without an external crystal for cost-sensitive builds, though the USB OTG peripheral will still want a precision clock source for full-speed operation.

Listed as Active by ST — no last-time-buy notice, no end-of-life risk on the horizon.

Peripheral set — what is on-chip

The 16-channel 12-bit ADC covers analog inputs like current-sense or thermistor readings.

Package considerations for the BGA variant

The 100-UFBGA (7x7 mm) is a 0.5 mm pitch BGA. That footprint saves board space versus a 100-pin LQFP, but it demands a solder-mask-defined pad and a stencil aperture sized for the ball diameter. Reflow profile follows the standard JEDEC MSL rating — no special bake if the sealed moisture-barrier bag is intact. For rework, a bottom-side preheat at 150°C and a focused hot-air nozzle on the BGA body lifts the part cleanly; the 7x7 mm body is small enough that thermal gradient across the package is manageable.

Frequently asked questions

What are the key differences between STM32F411VEH6U and STM32F411VET6?

Both share the same core, Flash, and RAM sizes. The VEH6U comes in a 100-UFBGA package (7x7 mm), while the VET6 is in a 100-pin LQFP. The BGA saves board area but requires a different PCB footprint and assembly process.