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STMicroelectronics STM32F411VEH6 — Microcontrollers & Processors (MCU / MPU / DSP)

STM32F411VEH6 ARM Cortex-M4 MCU, 100 MHz, 512 KB Flash

MPNSTM32F411VEH6
Active

STMicroelectronics STM32F4 series STM32F411VEH6, ARM Cortex-M4 32-bit MCU, 100 MHz, 512 KB Flash, 128 KB RAM, 81 I/O, 100-UFBGA (7x7 mm), -40 to 85 °C, 1.7 to 3.6 V.

$9.6000Ref. price · indicative, final on quote
Packaging100-UFBGA
RoHSROHS3 Compliant
SeriesSTM32F4
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

STM32F411VEH6 specifications
ParameterValue
SeriesSTM32F4
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.7V ~ 3.6V
Operating temperature-40°C ~ 85°C (TA)
Speed100MHz
PackageTray
RAM size128K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
ConnectivityI²C, IrDA, LINbus, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Number of i (O)81
Core processorARM® Cortex®-M4
Case100-UFBGA
Data convertersA/D 16x12b
Program memory size512KB (512K x 8)

Product details

The Cortex-M4 includes a single-precision floating-point unit, so FIR filters, FFTs, and PID loops run in hardware rather than soft-emulated — a meaningful difference from an M3 or M0+ part if your firmware does any real-time math. The 512 KB on-chip Flash and 128 KB SRAM give you room for a moderate application stack: RTOS, USB stack, and a couple of control loops fit without needing external memory.

Peripheral set and I/O budget

With 81 I/O lines brought out on the 100-UFBGA package, this part can handle a sensor array, a parallel LCD bus, and still leave pins for UART and SPI debug headers.

That saves board area versus a 100-pin LQFP, but it means the PCB fab needs via-in-pad or microvias for routing, and the reflow profile must be BGA-capable.

That means normal production, no last-time-buy clock ticking, and standard lead times through the distribution channel. The base product number is STM32F411, so firmware and board layout are shared across the VE density options — a useful hedge if you need to scale Flash or RAM in a future spin without a PCB change. ROHS3 compliant.

Frequently asked questions

What is the difference between STM32F411VEH6 and STM32F411VET6?

The difference is the package: the VEH6 is a 100-UFBGA (7x7 mm, fine-pitch BGA), while the VET6 is a 100-pin LQFP (14x14 mm, gull-wing leads). The BGA saves space but requires a more advanced PCB process; the LQFP is easier to hand-solder and inspect. Choose the package that matches your assembly capability and board area budget.

What package is the STM32F411VEH6 in?

The STM32F411VEH6 is supplied in a 100-UFBGA (Ultra Fine-pitch Ball Grid Array) package, measuring 7x7 mm. It is a surface-mount BGA with a fine ball pitch, suitable for compact designs with controlled PCB routing.