100-UFBGA package — footprint and routing notes
Housed in a 100-ball UFBGA measuring 7x7 mm, this part is a fine-pitch BGA (0.5 mm ball pitch typical for the package). The exposed centre pad (if present on this variant) should be stitched to the ground plane with at least four thermal vias to keep junction temperature within limits at the 84 MHz operating point.
ST lists the STM32F401VCH6 as Active. For new designs the part is safe to qualify; for production lines already using it, the supply channel is the standard distribution network, not a shrinking surplus pool.