72 MHz Cortex-M4 with 64 KB Flash in a WLCSP footprint
The 49-ball WLCSP (0.4 mm pitch) shrinks the board footprint to roughly 3.3 x 3.3 mm — a space-critical fit for handheld or multi-axis drives where every mm² counts.
Industrial temp, analog peripherals, and connectivity
Connectivity covers CANbus, I²C, SPI, UART/USART, USB, and LINbus — enough for a CANopen node or a sensor hub with a USB debug port.
The 49-WLCSP package is a direct-solder-ball die — no mould compound, no overmould. That means the silicon backside is exposed, and the balls are 0.4 mm pitch. Reworking this by hand is possible with a hot-air station and a fine stencil, but the thermal mass is low; too much heat lifts the die-side pads. If your assembly line isn't set up for WLCSP, the LQFP-48 variant (STM32F302C8T6) offers the same core in a more rework-friendly package.
For dual-sourcing resilience, the STM32F302 series shares pin-compatibility across density options within the same package — a 128 KB Flash sibling (STM32F302CCT6) can drop in if firmware fits.