72 MHz Cortex-M3 with 1 MB Flash — the high-density STM32F103
STM32F103ZGH7 packs 1 MB of Flash and 96 KB of SRAM, making it the high-density member of the family — sized for firmware-heavy applications like motor drives, industrial PLCs, and communication gateways that need to hold a full protocol stack plus application code. The 144-LFBGA (10x10 mm) package brings 112 I/O lines, including multiple SPI, I2C, UART/USART, and a full-speed USB 2.0 interface. On-chip peripherals include DMA, motor-control PWM, a temperature sensor, and a watchdog timer — the usual STM32F103 complement, but with the I/O count and memory headroom to handle more complex control loops.
CANbus connectivity confirmed
The connectivity list includes CANbus, so this MCU can serve as a CAN node in automotive aftermarket, industrial automation, or building-management systems. The bxCAN peripheral supports 2.0 A and 2.0 B active, with three transmit mailboxes and two receive FIFOs — enough for a typical gateway or sensor hub without an external CAN controller.
STMicroelectronics lists this part as Active.
144-LFBGA footprint and rework notes
If your rework lab handles BGA regularly, this is routine; if not, budget for a stencil design with 0.4 mm aperture and a nitrogen-assisted reflow to minimize solder ball bridging.