112 I/O and BGA routing considerations
The STM32F103ZEH7TR: With 112 I/O lines brought out to a 144-ball LFBGA, this MCU demands a multilayer PCB with via-in-pad or microvia capability for fanout. The 10x10 mm BGA pitch is fine enough that a two-layer board is impractical for most designs — plan for at least four layers. The supply range of 2.0 to 3.6 V on Vdd covers both 3.3 V and 2.5 V rails, but the I/O are not 5 V tolerant unless explicitly stated.
The base product number STM32F103 is a long-running STM32F1 series line with broad distribution support, so supply continuity is stable through franchised and independent channels. For dual-sourcing resilience, the STM32F103 family includes multiple density and package options that are pin-compatible across the 144-ball BGA footprint, though the exact Flash and RAM sizes vary.
