This is the mainstream-density member of the family, sized for control applications that need a real-time core with a balanced memory budget — motor drives, field-sensor nodes, and CAN-linked industrial peripherals are its typical deployment.
Industrial temperature and BGA footprint
The 64-TFBGA (5x5 mm) package saves board area versus a TQFP-64 but requires controlled-impedance layout and X-ray inspection for BGA solder joints — a factor for assembly yield planning.
Peripherals and connectivity set
On-chip peripherals include DMA, motor-control PWM, programmable voltage detector (PVD), power-on reset (POR), and a temperature sensor.