What the 64-TFBGA package means for the board
The STM32F103R8H6TR uses a 64-TFBGA (5x5 mm) package — a fine-pitch BGA with no exposed thermal pad, so all 51 I/O and supply pins route through the ball array. That means a four-layer board with microvias or at least a tight via-in-pad layout is the practical minimum, not a luxury.
That means ST continues to manufacture and support it for new designs.
The STM32F103R8H6TR integrates a 16-channel 12-bit ADC, DMA controller, motor-control PWM, and a full set of watchdog timers. Connectivity includes CAN, USB, SPI, I²C, UART/USART, IrDA, and LINbus.
Sourcing posture
No stock or lead-time number can be stated here, but the active status means supply is not constrained by a phase-out — the part is still in regular production at ST.