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STMicroelectronics STM32F051T8Y6TR — Microcontrollers & Processors (MCU / MPU / DSP)

STM32F051T8Y6TR STM32F0 MCU, 48MHz Cortex-M0, 64KB Flash

MPNSTM32F051T8Y6TR
Active

STMicroelectronics STM32F0 series, STM32F051T8Y6TR, 32-bit ARM Cortex-M0 MCU, 48MHz, 64KB Flash, 8KB RAM, 29 I/O, 36-WLCSP, -40 to 85°C, ROHS3.

$4.2300Ref. price · indicative, final on quote
Packaging36-UFBGA, WLCSP
RoHSROHS3 Compliant
SeriesSTM32F0
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

STM32F051T8Y6TR specifications
ParameterValue
SeriesSTM32F0
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))2V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed48MHz
PackageTape & Reel (TR); Cut Tape (CT)
RAM size8K x 8
Core size32-Bit Single-Core
PeripheralsDMA, I²S, POR, PWM, WDT
ConnectivityHDMI-CEC, I²C, IrDA, LINbus, SPI, UART/USART
Number of i (O)29
Core processorARM® Cortex®-M0
Case36-UFBGA, WLCSP
Data convertersA/D 13x12b; D/A 1x12b
Program memory size64KB (64K x 8)

Product details

Cortex-M0 core and memory budget for control-loop applications

The STM32F051T8Y6TR runs an ARM Cortex-M0 core at 48 MHz, which sets the throughput ceiling for sensor fusion, motor-control loops, or protocol bridging in a space-constrained BOM. With 29 general-purpose I/O pins in a 36-ball WLCSP package, the pin-to-ball ratio is high — most balls serve as GPIO or alternate-function pins, leaving few dedicated power or ground balls. The board layout must decouple the supply rails close to the package to keep the core stable under transient loads.

Analog integration and peripheral set

The ADC sample rate is not listed in the spec table, but the 12-bit resolution is adequate for 1% accuracy loops. Connectivity includes I²C, SPI, USART/UART, LINbus, IrDA, and HDMI-CEC — the USART supports LIN for automotive body electronics, and the I²C/SPI pair handles local sensor buses. DMA and PWM peripherals offload the core for periodic tasks like LED dimming or stepper-motor pulse trains.

Package and assembly constraints for the 36-WLCSP

The 36-WLCSP (Wafer-Level Chip-Scale Package) has no molded body — the die is the package. The ball pitch and diameter are not listed in the spec table, but a WLCSP of this ball count typically uses 0.4 mm or 0.5 mm pitch, requiring a controlled solder-paste volume and a reflow profile matched to the board's CTE. The supplier device package is 36-WLCSP, and the mounting type is surface mount.

Temperature grade and supply voltage envelope

The base product number is STM32F051, and the series is STM32F0.

Frequently asked questions

What is the closest pin-compatible alternative to the STM32F051T8Y6TR?

The STM32F0 series includes other WLCSP-36 devices with different memory or peripheral mixes, but a direct pin-for-pin replacement is not confirmed. The base product number STM32F051 covers several flash/RAM variants in the same package — check the STM32F051 family ordering codes for a parametric match.

What compliance documentation does STMicroelectronics provide for the STM32F051T8Y6TR?

The part is ROHS3 Compliant per the lifecycle record. Standard STMicroelectronics documentation includes the datasheet, reference manual, and application notes for the STM32F0 series.