48 MHz Cortex-M0 with 64 KB Flash — fit for industrial control and sensor fusion
Industrial temperature grade and BGA package — design-in considerations
The 64-UFBGA (5x5 mm) footprint is the tightest package option in the STM32F051 family — the 0.5 mm ball pitch requires controlled impedance and via-in-pad techniques if you route all 55 I/O. On-chip DMA, POR, PWM, and WDT reduce external glue logic.
STMicroelectronics lists the STM32F051R8H7TR as Active. For dual-sourcing flexibility, the STM32F051 family includes several Flash and package variants — the base product number STM32F051 covers the common footprint options.
This STM32F051R8H7TR is available to source through independent distribution channels. No franchised-stock claim is made; each lot is traceable to ensure authenticity.
