STL36N60M6

STMicroelectronics · MDmesh™ M6 Series

STMicroelectronics MDmesh™ M6 series, STL36N60M6, N-Channel MOSFET, 600V Vdss, 25A Id, 110mOhm Rds(on) at 10V, PowerFlat™ (8x8) HV surface-mount package, -55°C to 150°C junction temperature.

STMicroelectronics STL36N60M6
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[IN STOCK] In Stock: 5 pcs
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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

STL36N60M6 specifications
Parameter / AttributeSpecification / Value
SeriesMDmesh™ M6
FET typeN-Channel
MountingSurface Mount
Drain to source voltage600 V
Drive voltage (Max rds on, min rds on)10V
Current - continuous drain (Id) @ 25°C25A (Tc)
Power dissipation160W (Tc)
Operating temperature-55°C ~ 150°C (TJ)
PackageTape & Reel (TR); Cut Tape (CT)
Vgs±25V
TechnologyMOSFET (Metal Oxide)
Case8-PowerVDFN
Vgs(th) (Max) @ id4.75V @ 250µA
Rds on (Max) @ id, vgs110mOhm @ 12.5A, 10V
Gate charge (Qg) (Max) @ vgs44.3 nC @ 10 V
Input capacitance (Ciss) (Max) @ vds1960 pF @ 100 V

Technical details

600 V, 25 A switching cell in a PowerFlat HV package

The 44.3 nC typical gate charge at 10 V means the gate-drive power budget is moderate — a 1 A driver can switch this FET in the 100–200 kHz range without excessive dissipation in the driver IC.

On-resistance and gate charge at the operating point

For a 12.5 A load at 100°C junction, budget roughly 1.5× the 25°C value. Input capacitance Ciss is 1960 pF typical at Vds=100 V. That capacitance, combined with the 44.3 nC gate charge, determines the switching transition time and the cross-conduction window during hard-switched transitions.

Active production, ROHS3, wide temperature range

The PowerFlat™ (8x8) HV package is a surface-mount 8-PowerVDFN with an exposed pad for heat sinking through the PCB. The thermal pad area on the board sets the junction-to-ambient thermal resistance — the datasheet layout recommendation is worth following for the full 160 W power dissipation rating.

STL36N60M6
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